Quality Conformance and Qualification of Microelectronic Packages and Interconnects

By: Pecht, Michael & Dasgupta, Abhijit & Evans, John W. & Evans, Jillian Y. (Eds. )

Price: $100.00

Quantity: 1 available

Book Condition: Very Good in Very Good dust jacket


461 pp. Spine bumped. Jacket edges worn. Describes how to develop qualification and quality assurance programs to achieve high reliability in microelectronics. ; 8vo 8" - 9" tall

Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Author Name: Pecht, Michael & Dasgupta, Abhijit & Evans, John W. & Evans, Jillian Y. (Eds. )

Categories: Technology & Engineering,

Edition: First Edition

Publisher: New York, John Wiley & Sons: 1994

Binding: Hardcover

Book Condition: Very Good in Very Good dust jacket

Seller ID: TECH0185

Keywords: QUALITY Control QUALITY Assurance ELECTRONIC Packaging